Applications
Applications
- Non-disposal and recycling of plant wastewater such as semiconductors,
LCDs, LEDs, and pharmaceuticals using pure water
(Back grinding, Dicing, Sawing, CMP, Ingot slicing, etc) - Applicable to general factory wastewater and sewage
Extension
- Silicon Powder Recovery
- Copper ion non-detectable level elimination system
- APHA Standartd Methods, Detection limit 1ppb) - Pure water, ultrapure water utility
system of RO type - Filter press and centrifugal separator, etc.
- seawater desalination system
- Hydrogen Peroxide Removal System
- Fluoride Removal System
- arsenic removal system
- Silica removal system
The shape of wastewater particle
Wafer Back Grinding
Wafer Dicing
Application case
DICING
DICING
SI INGOT GRINDING
DIE SAW
BACK GRINDING
BACK GRINDING
| Company | Model | WW type |
|---|---|---|
| D社 (masan) | SW-100 | Dicing |
| B社 (anseong) | SW-10 | Dicing |
| K社 (anseong) | SW-80 | Dicing |
| S社 (gumi) | SW-100 | Slicing |
| Company | Model | WW type |
|---|---|---|
| W社 (yongin) | SW-10 | CMP |
| W社 (yongin) | SW-100 | CMP |
| L社 (gumi) | SW-100 | Dicing |
| E社 (Brazil) | SW-10 | Dicing |